關於建舜 / 服務項目

EMS

Introduction

Overview

Joinsoon provides a comprehensive manufacturing service with the most effective and advanced technology available. In one facilities, JEM is able to provide design, tooling, injection molding, cables, connector, SMT/DIP, assembly, product packaging.

Major Equipment

  1. Surface Mounting Machine (Panasonic/Fuji).
  2. High Speed Surface Mounting Machine (Panasonic/Fuji).
  3. Lead-Free Reflow.
  4. Wave solder.

Location

The EMS department, currently equipped with approximately 800 employees, has the capacity to manufacture15,000 units per day. Strategically located in Dongguan, China, where all major electronics manufacturers are located, it is able to meet all specific requests such as customized IC chips and all other electronics parts. With the advanced equipment and technology invested in this location, JEM is well able to provide the most competitive pricing for all major components.

Quality Assurance

JEM is certified to ISO 9001:2000 by LRQA. All staffs are not only well trained but also tested to be qualified on every specific task. The key to JEM's quality assurance policy is the preparation and prevention from error to delivery of the best services. All bridge boards have to pass ICT testing and functionality testing before any further process. JEM is committed to meet customer specified requirements to customers’ full satisfaction through continual improvement in manufacturing procedure and service standard.

Manufacturing Capability 

SMT Productivity

SMT:
R/C CHIP 1 KK pcs/Day
IC 50 K pcs /Day

DIP + Test : Bridge Board
9 K pcs / 1 shift /Day
18K pcs / 2 shifts/Day

SMT Manufacturing Capability

0603( in. 0201 )Chip.
0.3 m/m Pitch QFP , PLCC , BGA.
Micro BGA / CSP Capacity.
Double PCB / 0.3 ~ 4 m/m thickness PCB.
Lead Free Capacity.

Assembly Productivity

External Enclosure: 15000pcs /1 shift /day
30000pcs / 2 shifts / day

Card Reader﹕25,000 pcs / day

SMT Procedure 

PCB Mounting

SMT Reflow ( Lead Free Reflow )

PCB Visual Inspection

Testing Line

Integrated test system

Repair Station

Repair Station

Facility 

Automatic Solder Printer

MPM: UP3030
MINAMI: MK8785V

High Speed Surface Mounting Machine

Panasonic: MPA-I (High Speed)
Fuji: CP643E (Ultra High Speed)

IC Placer (Multi-Purpose Modular Monuter)

Panasonic: MV 2 C-A
Fuji: QP242E

Lead-free Reflow

SEHO: FDS6500(2.7)
JT: GS-600

Production Flow 

PCBA Flowchart

Assembly Flowchart

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